Xpert Insights Ep. 2: Hop on the I3C Bus: I3C Interface vs. Other Interface Protocols

On November 22, 2024, I attended a webinar titled “Xpert Insights Ep. 2 – Hop on the I3C Bus – I3C Interface vs. Other Interface Protocols,” which was hosted via Zoom and organized by Xinyx Design’s Tech. The session was led by Engr. Earl Lacida, a Senior Design Engineer, who shared his deep expertise on hardware interface protocols.

The focus of the webinar was on the I3C (Improved Inter-Integrated Circuit) Interface, a next-generation communication protocol developed by the MIPI Alliance. Engr. Lacida discussed I3C’s significant advantages over traditional protocols like I2C and SPI, highlighting features such as faster speed, lower power consumption, scalability, and backward compatibility with I2C. He also presented a comparative analysis of the protocols, providing participants with insights on when and why to consider I3C in various real-world applications.

Attending this webinar greatly expanded my understanding of communication protocols used in embedded systems and device design. I learned how I3C was specifically designed to overcome the limitations of I2C and SPI, offering higher data rates and more efficient power usage. Engr. Lacida’s use of real-world case studies helped me better grasp these concepts, making them more relatable. The session also reinforced the importance of staying updated with emerging technologies, especially in the rapidly evolving fields of hardware and electronics design.

The knowledge gained is particularly valuable in scenarios where selecting the right communication protocol can impact system performance and efficiency—especially in projects involving sensors or microcontroller-based systems. Understanding the strengths and limitations of I3C compared to I2C and SPI will aid in making informed design decisions for hardware projects, whether in academic or professional settings. This is especially relevant for future capstone projects, Arduino-based systems, or when working with real-time embedded devices.

The webinar was well-organized and ran smoothly from start to finish. The topic was highly relevant, particularly for those involved in electronics and embedded systems. Engr. Lacida’s clear delivery, paired with visual comparisons and practical insights, made complex concepts easy to understand. The Q&A session was also valuable, with the speaker providing thorough answers to technical questions. The Zoom platform was used effectively for both the presentation and participant interaction.

For future webinars, I would suggest providing downloadable materials such as a copy of the presentation slides or a summary document to reinforce the learning. A short hands-on demo or simulation, even if recorded, would also be beneficial—especially for visual and kinesthetic learners. Additionally, creating breakout rooms for small group discussions could enhance engagement, allowing participants to share insights and discuss topics more deeply.